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Tecal X6000 High-density Server

The HUAWEI Tecal X6000 high-density server (the X6000) is designed to meet requirements for cloud computing, data centers, and Internet applications. Underpinned by optimized architecture, the X6000 forms a high density, cost-efficient solution that incorporates various nodes, positioning it as the superior choice for large-scale server applications.


High Density Enables More Servers

  • The X6000 can accommodate 4 half-width or 2 full-width node servers in a space of just 2 U. A cabinet can hold up to 80 half-width node servers, which is four times the server density offered by a conventional 2 U rack server.


Multiple Types of Node Servers Facilitate Various Application Scenarios

  • Huawei provides 5 node server models, including 3 half-width and 2 full-width node servers.
  • Supports Intel® Xeon® E3-1200 V2 series, Intel® Xeon® E5-2400 series, and Intel® Xeon® E5-2600 series CPUs, and enables you to choose node servers that achieve the required performance and are configured to meet actual service requirements.
  • Huawei offers customized node servers based on customer requirements.


Excellent Energy Efficiency Control Minimizes Energy Consumption

  • 80 Plus® Platinum PSUs provide a maximum efficiency of 94% under a 50% load, reducing power losses and optimizing power utilization.
  • The X6000 boosts heat dissipation efficiency and cuts heat loss by adopting high-efficiency energy-saving fans and an optimized heat dissipation system that isolates power air ducts from node servers.
  • The X6000 deploys various energy-saving technologies including fan speed control by area, intelligent fan speed adjustment, and intelligent CPU frequency adjustment. These combine to decrease power consumption to form a fully green solution.


Front-Maintenance and Rear Routing Ensures Identical Maintenance Modes

  • Allows you to insert, remove, and maintain node servers from the front of cabinets in the same way as conventional rack servers.
  • Enables conventional maintenance modes by providing network ports at the rear and allowing cable routing from the rear in the same way as conventional rack servers.


Item Specifications
Dimensions (H x W x D) 87.5 mm (2 U) x 448 mm x 760 mm (3.44 in. x 17.60 in. x 29.92 in.)
Node server Supports up to 4 half-width node servers or 2 full-width node servers.
Half-width: XH310 V2, XH311 V2, and XH320 V2; full-width: XH620 V2 and XH621 V2
PSU Supports up to two 750 W, 800 W or 1200 W hot-swappable PSUs in 1+1 redundancy mode for load balancing
Fan module Supports 3 fan modules in N+1 redundancy mode
I/O module Supports one removable I/O module for providing four PCIe 2.0 x8 slots
Power supply 110/220 V AC, and –48 V DC
Backplane Provides a high-speed and passive backplane that prevents single point failures
Certification CCC, CE, UL, FCC, RoHS
Operating temperature* 10–40ºC (50–104ºF)

Operating temperature: 10–40ºC (50–104ºF) for XH310 V2 and XH311 V2, and 10–35ºC (50–95ºF) for the other node servers.


Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm



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