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Tecal XH310 Node Server

Tecal XH310 node server is cost-effective and web2.0 node server, provides lower power consumption server for flexibility requirements.


Cost-Effective, Building Access Applications

  • The XH310 node with UP Quad-Core Intel® Xeon®3400 series processors.
  • Provide 4 DDR3 DIMM slots.
  • Provide one 3.5-inch hot-swap hard disk.


Shared Infrastructure, High-Reliability Design

  • The infrastructure redundancy, the system with no single point failure, support enterprise core applications.
  • Carrier-class test and certification, carrier-class components and manufacturing technology.
  • 12V high reliability passive backplane, backplane addition to the connector plug, there is no active device to ensure high reliability of the backplane.


Low Energy Consumption, Reducing Operating Costs

  • Compared to 2U rack server, the same CPU / memory / hard disk configuration, reduce energy consumption by 10%.
  • The intelligent technology of wind speed control, reduce server power consumption , noise and extend fan's life .
  • Optimization of system duct design and dynamic energy-saving technologies to enhance the cooling efficiency.


Intelligent Platform to Easily Manage

  • All FRU support hot swapping.
  • Support IPMI 2.0 specification.
  • Support SOL / KVM Over IP / virtual drive such as remote maintenance function, reduce operating costs.
  • The Zero touch concept of remote maintenance capabilities, reduce operation and maintenance costs.

Item XH310
Processor sockets 1
Processor Quad-core Intel® Xeon® 3400 processor of all series are supported
Memory slot Four DDR3 DIMM slots, supporting a maximum memory of 32GB
Embedded hard disk One 3.5-inch SATA disk
Network interface Integrates two GE controllers adopting Intel 82576;
Integrates one FE controller (management network interface)
Management interface Integrates the BMC module to support IPMI, SQL, KVM over IP, and virtual drive
OS & Virtual system Windwos 2003/2008
SUSE Linux 10/11
Redhat Linux 4/5
Vmware
Citrix Xen Server
Dimensions Height: 41mm (1.61 in.)
Depth: 540mm (21.30 in.)
Width: 210mm (8.27 in.)
Temperature 10ºC–40ºC


Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm