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Chasis de servidor blade Tecal E6000H

El chasis E6000H adopta la distribución optimizada y el diseño de espacio del chasis E6000, también utiliza una tarjeta madre posterior pasiva de alta velocidad para soportar la conmutación de 10 GE o FC de 8G. Esto lo convierte en la mejor alternativa para escenarios de implementación de clústeres de alta densidad. El chasis E6000H se puede instalar en un gabinete estándar de 19 pulgadas a una profundidad de, al menos, 1000 mm. Se proporcionan dos tipos de chasis E6000H: CA y CC.

Tecal E6000H Blade Server Chassis 4

  • Tecal E6000H Blade Server Chassis 1
  • Tecal E6000H Blade Server Chassis 2
  • Tecal E6000H Blade Server Chassis 3
  • Tecal E6000H Blade Server Chassis 4

Outstanding Performance Thanks to Optimized Architecture

  • Provides 8 U space for 10 blade servers and optimized layout for fans, PSUs, switch modules, and management modules. The architecture meets single-node computing performance and power consumption balance requirements, and maintains an excellent space balance in a fully-configured 42 U cabinet.
  • Supports the BH620 V2, BH621 V2, BH622 V2, and BH640 V2 blade servers with Intel® Xeon® E5 series CPUs to meet low-end, middle-range, and high-end customer requirements.
  • Supports up to six GE, 10GE, FC switch or straight through modules.

High Reliability and Energy-Saving

  • Uses a cost-effective AC/DC or DC/DC converter to supply 12 V DC power and achieve a power conversion efficiency of up to 92% to reduce losses from power conversion.
  • Uses optimized air ducts, and supports power capping, power alternate hibernation, and intelligent fan speed adjustment to reduce system power consumption and improve heat dissipation efficiency for maximum power consumption management and control.
  • Uses N+1 redundant fans and N+N redundant management modules, PSUs, and switch modules; supports load balancing; provides seamless failover; and uses a passive backplane to prevents single point failures and ensure data security.
  • Uses carrier-class design, manufacturing process, and components to ensure high reliability.

Easy and Efficient Management Thanks to Intelligent Platform

  • Supports hot swap for all FRUs.
  • Supports IPMI 2.0 specifications to monitor hardware operations and record and query alarms and logs.
  • Supports SOL, KVM over IP, Web UI, and virtual media.
  • Supports a variety of protocols including the SNMP v3, SNMP Trap v1, SSL, SSH, RMCP, and RMCP+.
  • Uses Zero Touch-based remote maintenance for startup, shutdown, and reset to reduce O&M costs.

Item Specifications
Dimensions (W x D x H) 447 mm x 810 mm x 353 mm (8 U) (17.60 in. x 31.89 in. x 13.90 in.)
Number of blade slots 10 slots for Huawei's BH series blade servers
Number of switch module slots 6 slots for Huawei switch modules, providing the backplane switch capacity of 3.25 Tbit/s. Modules supported as follows:
NX910 GE straight through module
NX120 4Gb FC switching module
NX220 8Gb FC switching module
NX226 8Gb FC straight through module
NX112 10GE upstream switching module
NX113 10GE upstream switching module
NX230 10GE switching module
Number of PSU slots 6 slots for 1600 W AC PSUs or 1300 W -48 V DC PSUs for hot swap
Supports N+N and N+M redundancy modes
Number of fan module slots 9 hot-swappable fan modules are installed, working in N+1 redundancy mode
Number of management module slots 2 slots for independent management modules
Supports IPMI 2.0, SOL, SSL, and SSH protocols
Supports CLI, IPMITools, RMCP+, and web for management
Power supply 110 V AC/220 V AC, or -48 V DC
Certification CE, FCC, GOST, RoHS, etc.

  NX910 GE straight-through module NX120 FC switch module
Picture

Dimensions (W x D x H) 29 mm x 325 mm x 236.5 mm (1.14 in. x 12.80 in. x 9.31 in.)
Network port 10 straight-through 1000Base-T ports (10/100M Base-T unsupported) 4 auto-negotiation optical ports at the rate of 1 Gbit/s, 2 Gbit/s, or 4 Gbit/s Supports SFP single-mode and multi-mode transceivers, and unicast and broadcast data exchanging
Management ports 1 I2C management port connected to the management module through the backplane

1 standard RS232 management serial port

1 I2C port and one 10/100Base-T management network port connected to the management module through the backplane



  NX220 8G FC switch module NX226 8G FC straight-through module
Picture

Dimensions (W x D x H) 29 mm x 325 mm x 236.5 mm (1.14 in. x 12.80 in. x 9.31 in.)
Network port 6 auto-negotiation optical ports at the rate of 2 Gbit/s, 4 Gbit/s, or 8 Gbit/s
Supports SFP single-mode and multi-mode transceivers, 4G SFP and 8G SFP+ optical modules.
Supports unicast and broadcast data exchanging. 		10 straight-through 8G FC SFP+ ports
Management ports

1 standard RS232 management serial port
1 I2C port and one 10/100Base-T management network port connected to the management module through the backplane

 1 I2C management port connected to the management module through the backplane



  NX112 10GE upstream switch module NX113 10GE upstream switch module NX230 10GE switch module
Picture

Dimensions (W x D x H) 29 mm x 325 mm x 236.5 mm (1.14 in. x 12.80 in. x 9.31 in.)
Network port Two 10 GE upstream SFP+ optical ports
2 stacking ports with the12 Gbit/s bandwidth for stacking E6000 chassis
Four 10/100/1000BASE-T auto-negotiation RJ45 Ethernet ports
Supports the L3 switching and multiple L3 routing protocols 		Two 10 GE upstream SFP+ optical ports
2 stacking ports with the12 Gbit/s bandwidth for stacking E6000 chassis
4 SFP GE optical ports
Supports the L3 switching and multiple L3 routing protocols 		Eight 10 GE upstream SFP+ optical ports
Supports the L3 switching and multiple L3 routing protocols
Supports switch stacking

Management ports

 One standard RS232 management serial port
One I2C port and one 10/100Base-T management network port connected to the management module through the backplane

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm



SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.


http://www.sap.com/index.epx