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Nodo de servidor Tecal XH311 V2

El nodo de servidor Tecal XH311 V2 de Huawei es un nodo de servidor de 2 sockets de nueva generación y de ancho medio para el servidor X6000. El XH311 V2 utiliza procesadores Intel® Xeon® de la serie E3-1200 v2 y soporta cuatro HDD o SSD SAS/SATA de 2,5 pulgadas y cuatro DIMM DDR3. Es la mejor elección cuando se debe acceder a los servidores con un alto nivel de confiabilidad de datos.

Tecal XH311 V2 Node Server 2

  • Tecal XH311 V2 Node Server 1
  • Tecal XH311 V2 Node Server 2

High reliability for web applications

  • The XH311 V2 supports four 2.5-inch SAS/SATA HDDs or SSDs. It provides higher reliability than the XH310 V2.


Low energy consumption and high density

  • The XH311 V2 uses one Intel® Xeon® E3-1200 v2 series processor and supports four DDR3 DIMMs and four 2.5-inch hard disks. It consumes less power than a conventional single-socket rack server.
  • A 2U server can hold four XH311 V2 server nodes, offering computing density four times that of a conventional 2U rack server.


Easy installation and O&M

  • The XH311 V2 is easy to install and remove and deploying services on it is a snap.
  • The BMC module provides functions such as SOL and remote KVM, startup, and shutdown, facilitating easy management and maintenance.

Item XH311 V2
Form factor

Half-width server node

Number of processors

1

Processor

Intel® Xeon® E3-1200 v2 series 4-core
L3 cache: 8 MB

Memory

4 DDR3 UDIMMs

Internal storage

4 hot-swappable 2.5-inch SAS/SATA HDDs or SSDs

RAID support

RAID 0, 1, 10, 5, and 6
RAID cache: 512 MB or 1 GB
Power-off protection: BBU or supercapacitor

LOM network port

2 GE ports

Expansion slot

Up to 2 PCIe slots

USB port

3 (3 USB ports provided by a high-density connector)

Management

Built-in BMC, which supports IPMI, SOL, KVM over IP, and virtual media features
One 10/100 Mbit/s RJ45 management network port

Operating systems supported

Microsoft Windows Server
Red Hat Enterprise Linux
SUSE Linux Enterprise Server

Operating temperature

5ºC to 40ºC

Certification

CCC, VCCI, CE, UL, FCC, RoHS

Dimensions

Height: 41 mm (1.61 in.)
Width: 210 mm (8.27 in.)
Depth: 540 mm (21.26 in.)

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm



SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.


http://www.sap.com/index.epx