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Chasis del servidor blade Tecal E9000

El chasis E9000 mide 12 U y presenta una estructura optimizada de distribución para aprovechar al máximo el espacio disponible, cuenta con 16 ranuras y Módulos de Alimentación (PSM) redundantes, módulos de disipación del calor, módulos de gestión y módulos de conmutación. El chasis E9000 se puede instalar en un rack estándar de 19 pulgadas a una profundidad de, al menos, 1000 mm. Se proporcionan dos tipos de chasis E9000: CA y CC.

Tecal E9000 Blade Server Chassis4

  • Tecal E9000 Blade Server Chassis1
  • Tecal E9000 Blade Server Chassis2
  • Tecal E9000 Blade Server Chassis3
  • Tecal E9000 Blade Server Chassis4

Superb performance

  • Supports evolution based on three generations of high-performance Intel processors.
  • Supports 48 DIMMs in a full-width slot with up to 1.5 TB of highly cost-effective memory capacity.
  • Supports 15 x 2.5" hard disks in a full-width slot.
  • Supports I/O acceleration using GPUs, PCIe SSDs, and DSP.
  • Supports half-width/700 W and full-width/1400 W for heat dissipation and power supply.
  • Supports 40GE and InfiniBand FDR (56G) and evolution to 100GE and InfiniBand EDR.


Converged architecture

  • Adopts a modular design for computing, storage, switching, power supply, and cooling.
  • Supports a dynamically scalable architecture by providing 2-socket and 4-socket compute nodes.
  • Provides various switch modules (such as GE, 10GE, FC, FCoE, and InfiniBand) that can be flexibly configured based on service requirements.


Green and Reliable

  • Adopts efficient Platinum AC PSMs with more than 95% power conversion efficiency.
  • Implements dynamic energy saving management functions.
  • Optimizes system air ducts to optimize heat dissipation.
  • Supports fully redundant function modules to enable seamless switchover.
  • Uses a passive midplane to prevent single point of failures.

Item E9000 Chassis
Form factor 12 U
Blade 16 half-width slots or 8 full-width slots; supports flexible configurations of single-slot, dual-slot, full-width, and half-width nodes and can accommodate up to 16 Huawei CH series half-width compute nodes
Switch module 4 slots for Huawei CX series switch modules (or eight sub switch modules) provide a midplane switching capability of 5.76 Tbit/s.
CX110 GE switch module: 12 x GE + 4 x 10GE uplink, 32 x GE downlink
CX116 GE pass through module: 32 x GE uplink, 32 x GE downlink CX310 10GE switch module: 16 x 10GE uplink, 32 x 10GE downlink
CX311 10GE/FCoE converged switch module: 16 x 10GE + 8 x 8G FC uplink, 32 x 10GE downlink
CX317 10GE pass through module: 32 x 10GE uplink, 32 x 10GE downlink
CX610 InfiniBand switch module (QDR 40Gbit/s, FDR 56Gbit/s): 18 x QDR/FDR uplink, 16 x QDR/FDR downlink
CX911/CX912 multi-plane switch module; supports FC ports: 16 x 10GE + 8 x 8G FC uplink, 32 x 10GE/16 x 8G FC downlink
PSM AC/DC PSM: Maximum six 3000 W AC or six 2500 W DC hot-swappable PSUs, N+N or N+M redundant
Fan module Provides 14 hot-swappable fan modules in N+1 redundancy mode
Management Complies with IPMI v2.0 and supports management functions such as remote startup, shutdown, reset, logging, hardware monitoring, SOL,KVM over IP, virtual media, fan module monitoring, and PSM monitoring
Supports 1+1 redundancy
Provides a local KVM port for server management
Power supply 110 V/220 V AC or –48 V DC
Operating temperature 5℃-40℃
Dimensions Height: 530 mm (20.87 in.)
Width: 442 mm (17.40 in.)
Depth: 840 mm (33.07 in.)

Switch Module

The E9000 supports eight types of switch modules: CX110 GE switch module, CX116 GE pass through module, CX310 10GE switch module, CX311 10GE/FCoE converged switch module, CX317 10GE pass through module, CX610 InfiniBand switch module, and CX911/CX912 10GE/FC multi-plane switch module. You can select the one that best suits your service requirements for network I/O. Their detailed specifications are described in the tables below:



Item CX110 GE switch module
Picture

Network port 12 x GE +4 x 10GE SFP+ uplink
32 x GE downlink
Network features L2: VLAN/MSTP/LACP/TRILL/Stack/IGMP
L3: RIP/OSPF/ISIS/BGP/VRRP/BFD/PIM
QoS: ACL/CAR/ DiffServ
Security: IPSG/MFF/DAI /DHCP Snooping
Management port 2 x RS232 management serial ports (one each for services and management)
1 internal management GE port for connecting to a management module
Dimensions Height: 388 mm (15.28 in.), width: 35.5 mm (1.40 in.), depth: 272 mm (10.71 in.)



Item CX116 GE pass through module
Picture

Network port 32 x GE uplink
32 x GE downlink
Dimensions Height: 388 mm (15.28 in.), width: 35.5 mm (1.40 in.), depth: 272 mm (10.71 in.)



Item CX310 10GE switch module
Picture

Network port 16 x 10GE uplink
32 x 10GE downlink
Network features L2: VLAN/MSTP/LACP/TRILL/Stack/IGMP
L3: RIP/OSPF/ISIS/BGP/VRRP/BFD/PIM
QoS: DCBX/PFC/ETS/ACL/CAR/DiffServ
Security: IPSG/MFF/DAI/FSB/DHCP Snooping
Management port 2 x RS232 management serial ports (one each for services and management)
1 internal management GE port for connecting to a management module
Dimensions Height: 388 mm (15.28 in.), width: 35.5 mm (1.40 in.), depth: 272 mm (10.71 in.)



Item CX311 10GE/FCoE converged switch module
Picture

Network port 16 x 10GE (FCoE)SFP+ and 8 x 8G FC SFP+ uplink;
32 x 10GE downlink
Network features L2: VLAN/MSTP/LACP/TRILL/Stack/IGMP
L3: RIP/OSPF/ISIS/BGP/VRRP/BFD/PIM
QoS: DCBX/PFC/ETS/ACL/CAR/DiffServ
Security: IPSG/MFF/DAI/FSB/DHCP Snooping
Management port 2 x RS232 management serial ports (one each for services and management)
1 internal management GE port for connecting to a management module
Dimensions Height: 388 mm (15.28 in.), width: 35.5 mm (1.40 in.), depth: 272 mm (10.71 in.)



Item CX317 10GE pass through module
Picture

Network port 32 x 10GE uplink
32 x 10GE downlink
Dimensions Height: 388 mm (15.28 in.), width: 35.5 mm (1.40 in.), depth: 272 mm (10.71 in.)



Item CX610 Infiniband QDR/ FDR switch module
Picture

Network port 18 QDR/FDR InfiniBand QSFP+ uplink
16 QDR/FDR InfiniBand QSPF+ downlink
Network features multicast forwarding and replication/load balancing/re-route around failed link/VL/
SL/SL to VL mapping/SM/SMA/Low latency forwarding/credit based flow control
Management port In-band management
Dimensions Height: 388 mm (15.28 in.), width: 35.5 mm (1.40 in.), depth: 272 mm (10.71 in.)



Item CX911/CX912 10GE/FC multi-plane switch module
Picture

Network port 16 x 10GE SFP+ and 8 x 8G FC SFP+ uplink
32 x 10GE/16 x 8G FC downlink
Network features

L2: VLAN/MSTP/LACP/MonitorLink/SmartLink
QoS: ACL/CAR/DiffServ
Security: SSH/DDoS Defense
CX911: integrates a Qlogic FC switch; CX912: integrates a Brocade FC switch

Management port 2 x RS232 management serial ports (one each for services and management)
1 internal management GE port for connecting to a management module
Dimensions Height: 388 mm (15.28 in.), width: 35.5 mm (1.40 in.), depth: 272 mm (0.71 in.)


Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm



SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.


http://www.sap.com/index.epx