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Servidor blade Tecal BH622 V2

El BH622 V2 presenta capacidades informáticas de densidad extremadamente alta y una gran capacidad de memoria. Adopta CPU Intel® Xeon®, serie E5-2600 a 135 W, hasta 24 ranuras para DIMM, dos HDD, memoria caché RAID de 512 MB/1 GB y una BBU opcional o un supercondensador para la protección contra potenciales interrupciones de energía. El BH622 V2 está diseñado para escenarios de servicios empresariales de alta gama que emplean virtualización, computación en nube y HPC. Es particularmente apropiado para las aplicaciones con requerimientos de alto rendimiento, como el procesamiento de imágenes y señales, los algoritmos financieros, la computación científica y el procesamiento sísmico.

Tecal BH622 V2 Blade Server4

  • Tecal BH622 V2 Blade Server1
  • Tecal BH622 V2 Blade Server2
  • Tecal BH622 V2 Blade Server3
  • Tecal BH622 V2 Blade Server4

Outstanding Computing Performance Based on High Density

  • Supports all Intel® Xeon® E5-2600 series quad-core, six-core, and eight-core CPUs to implement outstanding eight-core 2.9 GHz computing performance.
  • Provides extreme performance with a 768 GB memory capacity and high memory throughput in 24 DDR3 DIMM slots.
  • Supports a maximum of two 2.5-inch hard disks, 512 MB/1 GB RAID cache, and an optional BBU or super capacity for power-off protection.


High Efficiency and Energy-Saving

  • Uses professional system architecture and air ducts to reduce shadow layout and improve heat dissipation efficiency.
  • Adopts Huawei's proprietary dynamic energy-saving solutions and power capping technology to optimize and control power consumption management and maximize efficiency.
  • Applies carrier-class design, manufacturing process, and components to ensure high efficiency.


Easy Management with the Intelligent Platform

  • Reduces O&M costs with hot-swappable FRUs and remote maintenance capability using the IPMI 2.0, SOL, KVM Over IP, and a virtual CD-ROM drive.
  • Uses built-in USB ports and Huawei's BMC management chips to provide customized management functions.
  • Uses the black box function to record system operating status in real time, and adopts TPM encryption security to ensure high reliability.

Item Specifications
Dimensions (W x D x H) 41.8 mm x 496 mm x 310 mm (1.65 in. x 19.53 in. x 12.20 in.)
Number of CPUs 1 or 2
CPU model All Intel Sandy Bridge-EP Xeon E5-2600 series quad-core/six-core/eight-core CPUs
Number of memory slots 24 DDR3 DIMM slots
Number of HDD Two 2.5-inch SAS disks, SATA disks, or SSDs
Maximum internal storage capacity 2 TB SATA
RAID supported RAID 0 and 1
512 MB/1 GB RAID cache with an optional BBU or super capacitor for power-off protection
Network Integrates 2 GE controllers that use Intel 82580 chips
Provides 2 PCIe MEZZ slots for GE, 4G FC, 8G FC, and 10GE MEZZ controller cards
Management Integrates the BMC and supports management features such as IPMI, SOL, KVM over IP, and virtual media
OSs supported

Microsoft Windows Server
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
Vmware ESX


Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm



SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.


http://www.sap.com/index.epx