Fault-tolerant design to ensure stable system operation

• Chip-level fault-tolerant features, such as automatic recovery for processors and links, ensure stable system operation.
• Memory mirroring and memory sparing prevent system shutdown caused by memory hardware faults.
• Full redundancy and hot swap maintenance are supported for key components, such as PSUs, fan modules, and hard disks, without the need for opening the chassis cover. These features facilitate quick replacement for faulty components during normal system operation, ensuring high system reliability.
• Some PCIe slots support hot swap without the need for opening the chassis cover. This ensures that there are no interruptions to the system operation during PCIe device replacement.
• The integrated intelligent management (iMana) software monitors system operation, triggers warnings, and rectifies faults.
• A diagnosis panel facilitates fault location, which reduces the time required to rectify faults.

Doubled the performance compared with our previous-generation product

• The RH5885H V3 supports four Intel® Xeon® E7-4800 v2 processors. The maximum number of cores per processor is increased from 10 to 15, and the maximum cache capacity increased from 30 MB to 37.5 MB.
• To maximize the concurrent processing capability, up to 60 cores and 120 concurrent threads are supported.
• A maximum of 96 DIMMs can be configured in the RH5885H V3. Using 64 GB DIMMs, the RH5885H V3 supports a maximum memory capacity of 6 TB, which meets large memory requirements for virtualization.
• Configured with Huawei ES series PCIe solid-state drives (SSDs), the RH5885 V3 provides excellent I/O performance, eliminating disk performance bottlenecks.
• The RH5885H V3 supports up to four dual-slot GPUs, greatly improving floating-point computing and graphics processing performance.

Outstanding scalability for various application scenarios

• A maximum of 16 full-height, full-length PCIe cards can be configured. Four of the PCIe cards are hot swappable and can be maintained without the need for opening the chassis cover.
• The RH5885 V3 supports eight or twenty-three 2.5" hard disks, which allows flexible configuration of the local storage capacity. This applies to distributed databases and big data analysis.
• Two built-in USB ports are provided for preinstalling an OS or encryption certificate.
• A plug-in NIC is used to provide LAN on motherboard (LOM). GE or 10GE ports can be flexibly configured.

Optimized energy efficiency to reduce OPEX

• Power capping is adopted to increase the server deployment density without the need for changing the equipment room design.
• The dynamic energy-saving technology adjusts the processor frequency and voltage according to the processor usage, reducing energy consumption.
• Platinum PSUs offer power efficiency of up to 94% at 50% loads.

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.

Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.

http://www.oracle.com/us/technologies/linux/026011.htm

SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.

http://www.sap.com/index.epx