X6000 High-density Server - Huawei Products
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X6000 High-density Server

The X6000 server is a high-density server designed for cloud computing, data centers, and Internet applications. With its optimized architecture, the X6000 offers high performance, rich server node options, and better energy efficiency, making the X6000 the ideal choice for large-scale server deployments.

High computing density

  • The X6000 is 2U high and features a centralized power supply and cooling. It accommodates four half-width or two full-width server nodes. It offers a density four times that of a conventional 2U rack server, allowing a rack to hold up to 80 half-width server nodes.
  • The X6000 enables quick deployment and easy maintenance by using a front-facing maintenance design and hot-swappable server nodes.

Rich server node options

  • The X6000 provides four half-width server nodes and one full-width server node. The server nodes support Intel® Xeon® E3-1200 v2 series, Intel® Xeon® E5-2400/E5-2600 series, and Intel® Xeon® E5-2400/E5-2600 v2 series, ensuring optimal performance based on service requirements.
  • The X6000 also offers options for customized server nodes, as needed.

Excellent energy efficiency and control

  • The 80 Plus® Platinum PSUs provide up to 94% power efficiency under a 50% load, which reduces power losses and optimizes power utilization.
  • The X6000 comes with highly efficient fan modules and an optimized cooling architecture that isolates power air ducts from server nodes, increasing cooling efficiency and reducing energy consumption.
  • The X6000 uses various energy-saving technologies, such as fan speed control by location, intelligent fan speed adjustment, and intelligent CPU frequency adjustment, which further reduce power consumption. In combination, these features offer a green, energy-saving solution.

Item X6000
Form factor

2U node server

Server node

Half-width server nodes: XH310 V2, XH311 V2, XH320 V2, and XH321 V2
Full-width server node: XH621 V2

I/O module

One removable I/O module with up to four PCIe 2.0 x8 slots


Two hot-swappable PSUs working in 1+1 redundancy mode
• AC: 750W, 800W, 1,200W
• DC: 800W

Fan module

Three fan modules working in N+1 redundancy mode

Power supply

110/220 V AC or −48 V DC

Operating temperature

XH310 V2 and XH311 V2: 5ºC to 40ºC
XH320 V2, XH321 V2, and XH621 V2: 5ºC to 35ºC




Height: 87.5 mm (3.44 in.)
Width: 448 mm (17.64 in.)
Depth: 760 mm (29.92 in.)

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.


As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.