FusionServer XH622 V3 Server Node - Huawei Products
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FusionServer XH622 V3 Server Node

The XH622 V3 is a new-generation Full-height 2-socket server node for the X6800 data center server. With Intel® Xeon® E5-2600 v3 series processors and flexible I/O expansion, the XH622 V3 is ideal for high-performance computing (HPC) and graphics acceleration.

High Density

  • The server nodes share the fan modules and PSUs in the chassis, minimizing space requirements.
  • The 4U high-density architecture occupies 50% less space than a traditional 2U rack server.

Outstanding Performance

  • Each XH622 V3 supports up to two Intel® Xeon® E5-2600 v3 series processors, 36 cores, 72 threads, and two 9.6 GT/s QuickPath Interconnect (QPI) links between processors.
  • A cabinet can be configured with a maximum of 40 XH622 V3 nodes and 80 high-performance GPGPUs or Xeon-Phi cards, offering 120 Tera-FLOPS and calculation peak performance of 120 trillion times.

High Energy Efficiency

  • Hard disks can be powered on at different times to reduce startup power consumption.
  • Dynamic energy conservation and power capping are used to minimize power consumption.
  • The 1.2 V DDR4 DIMMs consume 20% less energy than DDR3 DIMMs.

Item XH622 V3
Form factor Full-height dual-socket server node occupying two slots
Number of processors 1 or 2
Processor model Intel® Xeon® E5-2600 v3 series processor
Number of memory slots 16 DDR4 DIMM slots
Local storage Four 2.5-inch SSDs or SAS or SATA HDDs
Network ports Two or four GE ports or two 10GE ports
PCIe expansion Up to 5 PCIe slots
Management The on-board iBMC module supports IPMI, SOL, KVM over IP, and virtual media, and provides one 10/100/1000 Mbit/s RJ45 management network port.
Supported OSs Citrix XenServer
Microsoft Windows Server
Oracle Enterprise Linux
Oracle Server VM
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Operating temperature 5°C to 40°C (41°F to 104°F)
Certification CE, UL, FCC, CCC, and RoHS
Dimensions (H x W x D) 166 mm x 109 mm x 680 mm

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.


As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.