X8000 High-Density Rack Server - Huawei Products
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X8000 High-Density Rack Server

The X8000 is a new-generation rack server designed for data centers and Internet applications. Featuring high density, energy efficiency, simple maintenance, and multiple applications, the X8000 is an ideal choice for data centers in large or group enterprises, governments, energy industries, and Internet enterprises.

High density and innovative architecture design

  • Provides excellent computing density by deploying up to 80 compute nodes or 40 storage nodes in a fully utilized, high-density rack at a height of 44U.
  • Supports up to 160 Intel® Xeon® processors when the X8000 is fully configured with compute nodes, providing computing density twice that of a conventional high-density 1U 2-socket rack server and four times that of a 2U 2-socket rack server.
  • Supports a storage capacity of up to 2 PB when the X8000 is fully configured with storage nodes, meeting requirements for server storage resource expansion as data increases.

Energy efficiency

  • Uses 12 large fan modules in two server zones for high-efficiency cooling.
  • Features intelligent processor frequency and voltage adjustment, hard disk hibernation, and power capping, which reduces energy consumption by 15% compared to conventional rack servers with the same configuration.

Stable and reliable system design

  • Provides redundant modules such as N+N redundant PSUs and N+1 redundant fan modules.
  • Uses a highly reliable passive backplane, which prevents any single point of failure and ensures stable system operations.

Quick delivery and accelerated service rollout

  • Supports factory pre-installation and integrated rack delivery, which shortens onsite delivery time and accelerates service rollout.

Item X8000
Form factor 44U high-density rack server
Server node 80 server nodes
PSU 8 hot-swappable 3,000 W AC PSUs in N+N redundancy mode
Fan module Eight 172 mm fan modules in N+1 redundancy mode
Management Remote Management Console (RMC)
Power supply 220 V single-phase AC or 380 V three-phase AC
280 V HVDC
Operating temperature DH310 V2: 5ºC to 40ºC
DH320 V2, DH321 V2, and DH628 V2: 5ºC to 35ºC
Certification CE, FCC, VCCI, RoHS
Dimensions Height: 2,100 mm (82.68 in.)
Width: 600 mm (23.62 in.)
Depth: 1,175 mm (46.26 in.)
Installation Reference Rack power supply: 12,000 W
Maximum weight: 1,200 kg

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.


As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.