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ES3000 High Performance PCIe SSD Card

HUAWEI Tecal ES3000 PCIe SSD card provides 400GB/800GB/1.2TB/2.4TB capacities, full-height half-length form factor, up to 770K (4KB block) read IOPS performance and up to 630K (4KB block) write IOPS performance, up to 3.2GB/s throughput bandwidth, support power-down protection.

Outstanding performance

  • Small size: FH-HL (full-height half-length)
  • Large capacity: 400GB, 800 GB, 1.2 TB, or 2.4 TB
  • High bandwidth: PCIe 2.0 x8 interface, up to 3.2GBps bandwidth
  • High IOPS: 4 KB block 100% random, the maximum read IOPS is 770K, the stable value is 760K; and the maximum write IOPS is 630K, the stable value is 240K
  • Low latency: 8 µs


Easy maintenance

  • Supports online upgrades to meet customized needs.
  • Integrated querying & management tool: queries the type/capacity/version/wear/bad block information of SSD device.
  • Log function: records key events.
  • Supports SNMP protocol for a unified management system.


Industry-leading reliability

  • Supports power-down protection to ensure data integrity.
  • Combines embedded ECC engine and RAID5 engine for two-dimensional error detection/correction mechanism.
  • Adopts the embedded data scrubbing engine to prevent data errors in advance.
  • Uses dynamic RAID algorithm in all channels to share resources and to maintain reliability during multiple chip failures.
  • Supports TRIM and sophisticated wear algorithms to enhance recovery efficiency, reduce write wear, and extend service life.


Evaluation reports:

Items Specifications
Capacity 400GB 800GB 1.2TB 2.4TB
Flash cell MLC MLC MLC MLC
Form factor Full-height, half-length Full-height, half-length Full-height, half-length Full-height, half-length
Bus interface PCIe 2.0 x8 PCIe 2.0 x8 PCIe 2.0 x8 PCIe 2.0 x8
Maximum read bandwidth 1.1 GB/s 2.2 GB/s 3.2 GB/s 3.2 GB/s
Read IOPS (Stable value, 4 KB, 100% random) 280,000 570,000 760,000 760,000
Read IOPS (Maximum value, 4 KB, 100% random) 290,000 600,000 770,000 770,000
Minimum read latency 49 µs 49 µs 49 µs 49 µs
Maximum write bandwidth 650 MB/s 1.2 GB/s 1.8 GB/s 2.8 GB/s
Write IOPS (Stable value, 4 KB, 100% random) 60,000 120,000 180,000 240,000
Write IOPS (Maximum value, 4 KB, 100% random) 160,000 330,000 480,000 630,000
Minimum write latency 8 µs 8 µs 8 µs 8 µs
Mixed IOPS (Stable value, 4 KB, R/W:7/3) 110,000 (R/W: 80,000/30,000) 260,000 (R/W: 180,000/80,000) 400,000 (R/W: 280,000/120,000) 430,000 (R/W: 300,000/130,000)
Power consumption 13 W to 20 W 20 W to 35 W 25 W to 50 W 25 W to 60 W
Weight 200g 300g 350g 350g
Power-down protection Yes Yes Yes Yes
Cell failure protection Yes Yes Yes Yes
Supported trim Yes Yes Yes Yes
Operate systems MS Windows Server 2003 SP2/2008 R2 64-bit
RHEL 5.0/5.1/5.2/5.3/5.4/5.5/5.6/5.7/5.8 64-bit
RHEL 6.0/6.1/6.2/6.3 64-bit
SLES 11 SP1/SP2 64-bit
CentOS 5/6
Ubuntu 10/11
VMware ESX 4.1/ ESXi 5.0



Environmental Specifications
Operating temperature 0℃ to 55℃ (air flow 300 LFM)
Storage temperature -40℃ to 70℃
Operating humidity 5% RH to 85% RH
Altitude ≤ 3000 m



International Standards
US/Canada FCC CFR47 Part 15 Class A
ICES-003 Class A
NMB-003 Class A
UL 60950-1, 2nd Edition, 2011-12-19
CSA C22.2 No. 60950-1-07, 2nd Edition, 2011-12
Europe IEC 60950-1:2005 (2nd Edition) + A1:2009 and/or
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
EN 55022:2010
CISPR 22:2008
EN 55024:2010
CISPR 24:2010
ETSI EN 300 386 V1.6.1:2012
ETSI ES 201 468 V1.3.1:2005
AS/NZS CISPR 22:2009
IEC 61000-3-2:2005+A1:2008+A2:2009/EN 61000-3-2:2006+A1:2009+A2:2009
IEC 61000-3-3:2008/EN 61000-3-3:2008
RoHS 2002/95/EC, 2011/65/EU, EN 50581: 2012
REACH EC NO. 1907/2006
WEEE 2002/96/EC, 2012/19/EU
Japan VCCI Class A

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