CH222 V3 Storage Expansion Compute Node - Huawei Products
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CH222 V3 Storage Expansion Compute Node

The CH222 V3 provides superior computing performance and a large storage capacity. Featuring Intel® Xeon® E5-2600 v3 series processors (up to 145 W) and support for up to 24 DIMM slots, 15 x 2.5" hard disks, and a 1 GB RAID cache, the CH222 V3 is suitable for big-data analysis and processing applications that require large storage capacity and high computing performance, such as videos, searches, and biological sciences.

Super storage and computing capabilities

  • Supports the full series of Intel® Xeon® E5-2600 v3 processors to deliver up to 2*eighteen-core 2.3 GHz of computing capacity.
  • Provides 24 DDR4 DIMMs at 1.5 times the usual height. These apply mainstream granules and double the memory capacity to up to 1.5 TB (providing the highest cost-efficiency for large-memory applications).
  • Supports 15 x 2.5" SAS/SATA HDDs or SSDs, which provide the highest storage capacity on a single node.


Minimum energy for maximum efficiency

  • Adopts the dynamic energy saving and power capping technologies to optimally manage and control power consumption with power remarkably reduced in low-load operating.
  • Applies superb design, manufacturing processes, and components to ensure high quality.


Intelligent platform for strong management

  • Reduces O&M costs by supporting remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
  • Provides efficient and secure power consumption analysis and control capabilities.
  • Complies with Intel® NM 3.0.
  • Provides a sub-3s power capping response on each compute node to optimize power consumption control.
  • Supports an intelligent and secure power-off mode for compute nodes.
  • Supports the black box function to facilitate quick fault location and service recovery.

Form factor Full-width 2-socket compute node
Number of processors 1 or 2
Processor model Intel® Xeon® E5-2600 v3 series
Number of DIMMs 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB (64 GB per DIMM)
Number of hard disks 15 x 2.5" SSDs, SAS HDDs, or SATA HDDs
Built-in Storage 2 x SATA DOM
2 x Micro SD cards ( Raid1 ), supporting hot swap without opening the chassis cover
1 x USB 3.0 Disk
RAID support RAID 0, 1, 10, 5, 50, 6, and 60
512 MB/1 GB RAID cache
PCIe expansion 2 PCIe x16 mezz modules
1 standard PCIe x16 full-height half-length card
Operating systems supported Microsoft Windows Server 2008/2012 Red Hat Enterprise Linux
SUSE Linux Enterprise Server Oracle Linux
CentOS
Citrix XenServer Huawei Fusionsphere VMware
Operating temperature 5ºC to 40ºC
Dimensions Height: 60.46 mm
Width: 423 mm
Depth: 537.2 mm

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm


SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.


http://www.sap.com/index.epx



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