CH220 V3 IO Expansion Compute Node - Huawei Products
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CH220 V3 IO Expansion Compute Node

Designed for application acceleration scenarios, VDI, virtualization and databases, the CH220 V3 provides superior scalability. Featuring Intel® Xeon® E5-2600 v3 series processors and support for up to 16 DIMM slots, 2 internal hard disks, and 6 standard PCI cards for various PCIe configurations, the CH220 V3 can be expanded for I/O acceleration components such as PCIe SSDs, GPUs, and HPC acceleration components.

Outstanding expandability

  • Supports the full series of Intel® Xeon® E5-2600 v3 processors to deliver up to 2*eighteen-core 2.3 GHz of computing capacity.
  • Provides 6 standard PCIe cards expansion slots for various PCIe configuration modes, including 6 full-height half-length single-slots, 1 full-height full-length dual-slot and four full-height half-length single slots, or 2 full-height full-length dual-slots. The cables to the 2 standard PCIe cards are routed from the front panel.
  • Provides 16 DDR4 DIMMs with the maximum total memory capacity of 1 TB (64 GB per DIMM).

Minimum energy for maximum efficiency

  • Adopts the dynamic energy saving and power capping technologies to optimally manage and control power consumption with power remarkably reduced in low-load operating.
  • Applies superb design, manufacturing processes, and components to ensure high quality.

Intelligent platform for strong management

  • Reduces O&M costs by supporting remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
  • Provides efficient and secure power consumption analysis and control capabilities.
  • Complies with Intel® NM 3.0.
  • Provides a sub-3s power capping response on each compute node to optimize power consumption control.
  • Supports an intelligent and secure power-off mode for compute nodes.
  • Supports the black box function to facilitate quick fault location and service recovery.

Form factor Full-width 2-socket compute node
Number of processors 1 or 2
Processor model Intel® Xeon® E5-2600 v3 series
Number of DIMMs 16 DDR4 DIMMs, providing a maximum memory capacity of 1 TB
Number of hard disks 2 x 2.5" SSDs, SAS HDDs, or SATA HDDs
Built-in Storage 2 x SATA DOM
2 x Micro SD cards ( Raid1 ), supporting hot swap without opening the chassis cover
1 x USB 3.0 Disk
RAID support RAID 0 and 1
PCIe expansion 2 PCIe x16 + 2 PCIe x8 mezz modules, supporting six standard PCIe cards. The following configuration modes are supported:
a. 6 full-height half-length single-slots
b. 1 full-height full-length dual-slot and four full-height half-length single-slots
c. 2 full-height full-length dual-slots
Operating systems supported Microsoft Windows Server 2008/2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Oracle Linux
Huawei Fusionsphere
Citrix XenServer
Operating temperature 5ºC to 40ºC
Dimensions Height: 60.46 mm
Width: 423 mm
Depth: 537.2 mm

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.


As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.

SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.