CH121 V3 Compute Node - Huawei Products
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CH121 V3 Compute Node

The CH121 V3 combines dense computing capabilities with an ultra-large memory capacity. Optimized for enterprise service applications such as virtualization, cloud computing, and high-performance computing, the CH121 V3 employs Intel® Xeon® E5-2600 v3 series processors (up to 145 W) and supports up to 24 DDR4 DIMM slots, 2 internal hard disks, and 1 standard PCI x16 full-height half-length card.

High Versatility

  • Supports the full series of Intel® Xeon® E5-2600 v3 processors to deliver up to 2*eighteen-core 2.3 GHz of computing capacity.
  • Provides 24 DDR 4 DIMMs at 1.5 times the usual height. These apply mainstream granules and double the memory capacity to up to 1.5 TB (providing the highest cost-efficiency for large-memory applications).
  • Supports 2 x 2.5" SAS/SATA HDDs or SSDs.

Minimum energy for maximum efficiency

  • Adopts the dynamic energy saving and power capping technologies to optimally manage and control power consumption with power remarkably reduced in low-load operating.
  • Applies superb design, manufacturing processes, and components to ensure high quality.

Intelligent platform for strong management

  • Reduces O&M costs by supporting remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
  • Provides efficient and secure power consumption analysis and control capabilities.
  • Complies with Intel® NM 3.0.
  • Provides a sub-3s power capping response on each compute node to optimize power consumption control.
  • Supports an intelligent and secure power-off mode for compute nodes.
  • Supports the black box function to facilitate quick fault location and service recovery.

Form factor Half-width 2-socket compute node
Number of processors 1 or 2
Processor model Intel® Xeon® E5-2600 v3 series
Number of DIMMs 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB
Number of hard disks 2 x 2.5" SSDs, SAS HDDs, or SATA HDDs, supporting 2 x PCIe SSD HDDs
Built-in Storage 2 x SATA DOM
2 x Micro SD cards ( Raid1 ), supporting hot swap without opening the chassis cover
1 x USB 3.0 Disk
RAID support RAID 0 and 1
PCIe expansion 2 PCIe x16 mezz modules
1 standard PCIe x16 full-height half-length card
Operating systems supported Microsoft Windows Server 2008/2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Oracle Linux
Huawei Fusionsphere
Citrix XenServer
Operating temperature 5ºC to 40ºC
Dimensions Height: 60.46 mm
Width: 210 mm
Depth: 537.2 mm

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.


As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.

SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.