CH140 Compute Node - Huawei Products
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CH140 Compute Node

Optimized for HPC and computing-dense enterprise services, the CH140 provides ultra high computing capabilities. A half-width slot supports two 2-socket compute nodes. Each compute node can be maintained independently. The CH140 uses Intel® Xeon® E5-2600 and E5-2600 v2 series processors and supports eight DIMM slots and one hard disk.

Outstanding computing performance based on ultra high density

  • Supports Intel® Xeon® E5-2600(up to 130W) and E5-2600 V2 full series processors to deliver up to 4 x 12-core 2.7 GHz computing capabilities; a half-width slot supports two small slots in two layers for installing two independent 2-socket compute nodes.
  • Provides eight DIMM slots on a 2-socket compute node, supporting a DDR3memory capacity of up to 256 GB on a 2-socket compute node.
  • Supports one internal 2.5" SSD on a 2-socket compute node.


High efficiency and energy-saving

  • Uses the dynamic energy saving and power capping technologies to optimally manage and control power consumption with power reduced in low-load operating.
  • Adopts the carrier-class design, manufacturing process, and component selection to ensure high quality.


Easy management with the intelligent platform

  • Reduces O&M costs by using remote deployment and fault locating methods including SOL, KVM over IP, virtual CD-ROM drive, and WebUIs in compliance with IPMI 2.0.
  • Supports efficient and secure power consumption analysis and control capabilities.
  • Complies with Intel® NM 2.0.
  • Implements efficient power consumption control by supporting power capping operations within 3s on a compute node.
  • Supports an intelligent and secure power-on mode for compute nodes.
  • Supports the black box function to facilitate fault location, quickly recovering services.

Item CH140 Compute Node
Form factor Two 2-socket compute nodes in a half-width slot
Number of processors 4
Processor model Intel® Xeon® E5-2600 and E5-2600 V2 series
Number of DIMMs 8 DDR3 DIMMs for each 2-socket compute node, up to 512 GB in a half-width slot
Number of hard disks One 2.5" SSD for each 2-socket compute node
PCIe expansion 2 PCIe x8 mezz module for each 2-socket compute node
Operating systems supported Microsoft Windows Server 2008 R2 Enterprise/Standard Edition 32/64bit
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
Operating temperature 5°C to 35°C
Dimensions

Height: 60.46 mm (2.38 in.)
Width: 215 mm (8.46 in.)
Depth: 525 mm (20.67 in.)

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm



SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.


http://www.sap.com/index.epx



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