Under Construction!

Prompt

Sorry that you are not authorized to download this document.

Apply Previous

Tecal CH220 IO Expansion Compute Node

Designed for application acceleration scenarios, VDI, virtualization and databases, the CH220 provides superior scalability and a huge memory capacity. Featuring Intel® Xeon® E5-2600 series processors (up to 135 W) and support for up to 24 DIMM slots, 2 internal hard disks, and 4 standard PCI x8 full-height half-length cards, the CH220 can be expanded for I/O acceleration components such as PCIe SSDs and GPUs.

Large memory and outstanding expandability

  • Supports the full series of Intel® Xeon® E5-2600 series quad-core, six-core, and eight-core processors to deliver up to 2*eight-core 2.9 GHz of computing power.
  • Provides 24 DIMMs at 1.5 times the usual height. These apply mainstream granules and double the memory capacity to up to 768 GB DDR3 (providing the highest cost-efficiency for large-memory applications).
  • Provides 4 PCIe x8 full-height half-length slots for installing 4 GPUs or PCIe SSDs, providing the best possible PCIe expansion capability on a single compute node.

(Note: card quantity is determined by card's physical size and the signal bandwidth.)



Minimum energy for maximum efficiency

  • Adopts the dynamic energy saving and power capping technologies to optimally manage and control power consumption with power remarkably reduced in lowload operating.
  • Applies carrier-class design, manufacturing processes, and components to ensure high quality.


Intelligent platform for strong management

  • Reduces O&M costs by supporting remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
  • Provides efficient and secure power consumption analysis and control capabilities.
  • Complies with Intel® NM 2.0.
  • Provides a sub-3s power capping response on each compute node to optimize power consumption control.
  • Supports an intelligent and secure power-off mode for compute nodes.
  • Supports the black box function to facilitate quick fault location and service recovery.

Item CH220 I/O Expansion Compute Node
Form factor Full-width 2-socket compute node
Number of processors 1 or 2
Processor model Intel Xeon E5-2600 series
Core options: 4, 6, or 8
Number of DIMMs 24 DDR3 DIMMs, providing a maximum memory capacity of 768 GB
Number of hard disks 2 x 2.5" SAS/SATA HDDs or SSDs
RAID support RAID 0 and 1
PCIe expansion

2 PCIe x16 mezz modules (Note: One module has been occupied)
4 standard PCIe x8 full-height half-length cards

Operating systems
supported
Microsoft Windows Sever 2008 R2 Enterprise/Standard Edition 32/64bit
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
Operating temperature 5℃-40℃
Dimensions

Height: 60.46 mm (2.38 in.)
Width: 423 mm (16.65 in.)
Depth: 525 mm (20.67 in.)

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.



Partnership

As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.


http://www.oracle.com/us/technologies/linux/026011.htm



SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.


http://www.sap.com/index.epx



DOCUMENTATION CENTER NEWS ROOM CASE STUDIES VIDEO ZONE PUBLICATIONS SHARE