CH240 Compute Node - Huawei Products
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CH240 Compute Node

The CH240 delivers outstanding computing performance and a large memory capacity. It adopts Intel® Xeon® E5-4600 or E5-4600 v2 series high-performance processors and supports 48 DDR3 DIMM slots, 8 hard disks, and RAID 0 1, 10, 5, 50, 6, and 60. The CH240 is designed for virtualization, cloud computing, high-performance computing, and cluster deployment to meet high-end enterprise service requirements. It is particularly suitable for applications with high performance requirements, such as image and signal processing, financial algorithms, scientific computing, and seismic processing.

Super large memory and strong computing capabilities

  • Supports Intel® Xeon® E5-4600 or E5-4600 v2 series processors, with up to 12 cores each, a 30 MB L3 cache, 8 GT/s QPI, hyper-threading, and Turbo acceleration technology.
  • Provides 48 DIMMs at 1.5 times the usual height. These apply mainstream granules and provide the memory capacity of up to 1.5 TB DDR3 (providing the highest cost-efficiency for large-memory applications).
  • Supports up to 8 x 2.5" SAS/SATA HDDs or SSDs, or SSDs (twice as many hard disks as competitors' 4-socket blade servers).

Minimum energy for maximum efficiency

  • Adopts the dynamic energy saving and power capping technologies to optimally manage and control power consumption with power remarkably reduced in lowload operating.
  • Applies carrier-class design, manufacturing processes, and components to ensure high quality.

Intelligent platform for strong management

  • Reduces O&M costs by supporting remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
  • Provides efficient and secure power consumption analysis and control capabilities.
  • Complies with Intel® NM 2.0.
  • Provides a sub-3s power capping response on each compute node to optimize power consumption control.
  • Supports an intelligent and secure power-off mode for compute nodes.
  • Supports the black box function to facilitate quick fault location and service recovery.

Item CH240 Compute Node
Form factor Full-width 4-socket compute node
Number of processors 2 or 4
Processor model

Intel® Xeon® E5-4600 or E5-4600 v2 series 4-core, 6-core, 8-core, 10-core and 12-core processors series
Core options: 4, 6, 8, 10, 12

Number of DIMMs 48 DDR3 DIMMs, providing a maximum memory capacity of 1.5 TB
Number of hard disks 8 x 2.5" SAS/SATA HDDs or SSDs
RAID support RAID 0, 1, 10, 5, 50, 6, and 60 with a 512 MB/1 GB RAID cache
PCIe expansion 2 PCIe x16 mezz modules
Operating systems
Microsoft Windows Server 2008/2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Oracle Linux
Citrix XenServer
Huawei Fusionsphere
Operating temperature 5℃-40℃

Height: 60.46 mm (2.38 in.)
Width: 423 mm (16.65 in.)
Depth: 525 mm (20.67 in.)

Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium, Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.


As a global telecommunications solutions provider, we corporate with Oracle technology as partner delivering a complete telecom product portfolio, covering mobile, broadband, core network, transmission network, data communication, value-added services, terminals and services. Our blade and rack servers are qualified for and fully support both Oracle Linux and Oracle VM. We endorse Oracle Linux support, and are a partner in the Oracle Validated Configurations program, which delivers easier, faster, and lower-cost deployment of Linux solutions in organizations worldwide.

SAP and Huawei would like to build strategic partnership, defending market together. Huawei had become SAP first Chinese Global Technology Partner since July 2012, it is also the only addition global technology partner of SAP in the past five years. SAP and Huawei will cooperate in enterprise applications, business analytics, mobile, cloud computing, database, etc, and will provide more competitive E2E solutions that bring value to customers.